Title:
SEMICONDUCTOR WAFER POLISHING METHOD AND POLISHING PAD SHAPING JIG
Document Type and Number:
WIPO Patent Application WO/2010/128631
Kind Code:
A1
Abstract:
Disclosed is a semiconductor wafer polishing method for polishing the surfaces to be polished of semiconductor wafers by use of polishing pads (16, 17) provided on fixing plates by relative movement of the polishing pads and the semiconductor wafers held by carriers. The shaping surfaces (25) of a polishing pad shaping jig (21) are shaped by inverting, with respect to ideal shapes, the shapes of the surfaces to be polished of each semiconductor wafer when the surfaces are polished by use of the polishing pads (16, 17) before shaping, and the shapes of the shaping surfaces of the polishing pad shaping jig are transferred to the pad surfaces (16A and 17A) of the respective polishing pads (16, 17). The surfaces to be polished of each semiconductor wafer are polished by use of the pad surfaces.
Inventors:
TAKAI, Hiroshi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
Application Number:
JP2010/057328
Publication Date:
November 11, 2010
Filing Date:
April 26, 2010
Export Citation:
Assignee:
SUMCO CORPORATION (2-1 Shibaura 1-chome, Minato-ku Tokyo, 34, 〒1058634, JP)
株式会社ＳＵＭＣＯ (〒34 東京都港区芝浦１丁目２番１号 Tokyo, 〒1058634, JP)
株式会社ＳＵＭＣＯ (〒34 東京都港区芝浦１丁目２番１号 Tokyo, 〒1058634, JP)
International Classes:
H01L21/304; B24B37/04; B24B53/12
Attorney, Agent or Firm:
MURAKAMI, Tomokazu et al. (9th foor, COI Minami-Ikebukuro Bldg. 27-17, Minami-Ikebukuro 2-chome, Toshima-k, Tokyo 22, 〒1710022, JP)
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