Title:
SEMICONDUCTOR WAFER PROTECTIVE DEVICE AND SEMICONDUCTOR WAFER TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2004/036642
Kind Code:
A1
Abstract:
A semiconductor wafer protective device which enables a semiconductor wafer to be handled as required without damaging it even when its back is ground to much reduce its thickness, and a semiconductor wafer treatment method using this semiconductor wafer protecting device. This semiconductor wafer protective device is constituted of a magnetized tape one side of which is adhesive and a magnetic substrate at least the central region of which has many holes.
Inventors:
KITAMURA MASAHIKO (JP)
NANJO MASATOSHI (JP)
YAJIMA KOUICHI (JP)
NAMIOKA SHINICHI (JP)
NANJO MASATOSHI (JP)
YAJIMA KOUICHI (JP)
NAMIOKA SHINICHI (JP)
Application Number:
PCT/JP2003/002194
Publication Date:
April 29, 2004
Filing Date:
February 27, 2003
Export Citation:
Assignee:
DISCO CORP (JP)
KITAMURA MASAHIKO (JP)
NANJO MASATOSHI (JP)
YAJIMA KOUICHI (JP)
NAMIOKA SHINICHI (JP)
KITAMURA MASAHIKO (JP)
NANJO MASATOSHI (JP)
YAJIMA KOUICHI (JP)
NAMIOKA SHINICHI (JP)
International Classes:
B24B7/22; H01L21/00; H01L21/02; H01L21/683; H01L21/301; H01L21/68; (IPC1-7): H01L21/68; H01L21/304; B24B37/04
Foreign References:
| JP2002059363A | 2002-02-26 | |||
| EP1195809A2 | 2002-04-10 | |||
| JPH0778864A | 1995-03-20 | |||
| JPH05114643A | 1993-05-07 | |||
| JP2002348554A | 2002-12-04 |
Attorney, Agent or Firm:
Ono, Hisazumi (1-21 Nishi-Shimbashi 1-chom, Minato-ku Tokyo, JP)
Download PDF:
Previous Patent: PROBE DEVICE THAT CONTROLS TEMPERATURE OF OBJECT TO BE INSPECTED AND PROBE INSPECTION METHOD
Next Patent: DEVICE
Next Patent: DEVICE