Title:
SEMICONDUCTOR WAFER RE-USE USING CHEMICAL MECHANICAL POLISHING
Document Type and Number:
WIPO Patent Application WO/2011/053560
Kind Code:
A3
Abstract:
Methods and apparatus for reducing damage of a semiconductor donor wafer include the steps of: (a) rotating a polishing pad, rotating the semiconductor donor wafer, applying a polishing slurry to the polishing pad, and pressing the semiconductor donor wafer and the polishing pad together; and (b) rotating the polishing pad and the semiconductor donor wafer, discontinuing the application of the polishing slurry, applying a rinsing fluid to the polishing pad, and pressing the semiconductor donor wafer and the polishing pad together, wherein step (a) followed by step (b) is carried out in sequence at least two times, and at least one of the following are reduced in at least two successive intervals of step (a): (i) a pressure at which the semiconductor donor wafer and the polishing pad are pressed together, (ii) a mean particle size of an abrasive within the polishing slurry, and (iii) a concentration of the slurry in water and stabilizers.
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Inventors:
BANKAITIS JONAS (US)
MOORE MICHAEL J (US)
MOORE MICHAEL J (US)
Application Number:
PCT/US2010/054015
Publication Date:
July 28, 2011
Filing Date:
October 26, 2010
Export Citation:
Assignee:
CORNING INC (US)
BANKAITIS JONAS (US)
MOORE MICHAEL J (US)
BANKAITIS JONAS (US)
MOORE MICHAEL J (US)
International Classes:
H01L21/304
Foreign References:
| US20050186891A1 | 2005-08-25 | |||
| US20030017784A1 | 2003-01-23 | |||
| US20060252267A1 | 2006-11-09 | |||
| US6294472B1 | 2001-09-25 |
Attorney, Agent or Firm:
WATSON, Bruce, P. (SP-Ti-3-1Intellectual Property Departmen, Corning New York, US)
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