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Title:
SEMICONDUCTOR-WAFER-SURFACE-PROTECTIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2013/122060
Kind Code:
A1
Abstract:
A semiconductor-wafer-surface-protective adhesive tape having a pressure-sensitive adhesive layer on a substrate film, wherein the thickness of the adhesive layer is 10μm or more, the surface free energy (γs) of the surface of the adhesive layer is 30-35 mN/m, the contact angle (θl I) in relation to diiodomethane is 54-60°, the adhesive force in relation to an SUS280 polished surface at 23°C is 0.8-4.3 N/25mm, and the adhesive force in relation to the SUS280 polished surface when heat-releasing at 50°C in comparison to the adhesive force when releasing at 23°C is 50% or less.

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JPH09111196DOUBLE-SIDE PRESSURE-SENSITIVE ADHESIVE MATERIAL
JP4707940Polarizing plate and its manufacturing method
Inventors:
YOKOI HIROTOKI (JP)
UCHIYAMA TOMOAKI (JP)
Application Number:
PCT/JP2013/053289
Publication Date:
August 22, 2013
Filing Date:
February 12, 2013
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J7/02; C09J133/00; C09J201/00; H01L21/304
Foreign References:
JPH04186832A1992-07-03
JP2002080804A2002-03-22
JP2000008010A2000-01-11
JP2003338535A2003-11-28
JPH0885779A1996-04-02
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
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