Title:
SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/073972
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor wafer and a semiconductor wafer with an adhesive layer provided with an adhesive layer formed on one surface of the semiconductor wafer and wherein the adhesive layer is formed inside of the peripheral part of the semiconductor wafer. The present invention also relates to a method for manufacturing a semiconductor device comprising a step for forming the adhesive layer, formed from an adhesive, on the inside of the peripheral edge on one surface of the semiconductor wafer and a step for bringing the adhesive to a B stage.
Inventors:
MORI SHUICHI (JP)
Application Number:
PCT/JP2011/077566
Publication Date:
June 07, 2012
Filing Date:
November 29, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
MORI SHUICHI (JP)
MORI SHUICHI (JP)
International Classes:
H01L21/52; H01L21/301
Foreign References:
| JP2008300521A | 2008-12-11 | |||
| JP2009194287A | 2009-08-27 | |||
| JP2009212439A | 2009-09-17 | |||
| JP2005116566A | 2005-04-28 | |||
| JP2005064499A | 2005-03-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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