Title:
SENSING DEVICE FOR QUALITY CONTROL OF MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/214612
Kind Code:
A1
Abstract:
The present invention relates to a sensing device for quality control of a molded product, wherein, in a sensor module: a hall sensor for counting the number of times a mold is opened is fixedly installed on a printed circuit board (PCB) for control; an acceleration sensor and a temperature sensor for quality control of a product are fixedly installed on a PCB for measurement; and a microcontroller unit (MCU) and a memory in which a control algorithm is stored are fixedly installed on the PCB for control.
Inventors:
LEE YOUNG-HWA (KR)
Application Number:
PCT/KR2022/008987
Publication Date:
November 09, 2023
Filing Date:
June 24, 2022
Export Citation:
Assignee:
LEE YOUNG HWA (KR)
International Classes:
B29C45/76; B29C45/73; B29C45/78; B29C45/80; H01F7/00; H04W88/02
Foreign References:
| KR20200134934A | 2020-12-02 | |||
| KR100621511B1 | 2006-09-14 | |||
| JP2010247410A | 2010-11-04 | |||
| US7476095B2 | 2009-01-13 | |||
| KR101919242B1 | 2018-11-15 |
Attorney, Agent or Firm:
LEE, Sang-mok (KR)
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