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Title:
SENSITIZING SOLUTION FOR ELECTROLESS PLATING AND ELECTROLESS PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/023895
Kind Code:
A1
Abstract:
A sensitizing solution for electroless plating, which can easily dissolve an Sn compound without using an acid and can be used for a long time without deteriorating the uniformity of metal plating films.  The sensitizing solution for electroless plating contains an Sn compound and a solvent, and the solvent contains not less than 10% by volume of a water-soluble alcohol.  An electroless plating method comprising a pre-treatment step wherein an object to be plated is immersed into a pre-treatment solution, and a plating step wherein the object to be plated went through the pre-treatment step is immersed into a plating solution.  In the electroless plating method, the sensitizing solution for electroless plating is used as the pre-treatment solution.

Inventors:
KOIWA ICHIRO (JP)
KANEDA TATSUMA (JP)
HASHIMOTO AKIRA (JP)
USUDA MASAHIKO (JP)
Application Number:
PCT/JP2009/004124
Publication Date:
March 04, 2010
Filing Date:
August 26, 2009
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
KANTO GAKUIN SCHOOL CORP (JP)
KOIWA ICHIRO (JP)
KANEDA TATSUMA (JP)
HASHIMOTO AKIRA (JP)
USUDA MASAHIKO (JP)
International Classes:
C23C18/18; C23C18/16; C23C18/28; H01L21/28; H01L21/288; H05K3/18
Foreign References:
JP2004527663A2004-09-09
JP2003155574A2003-05-30
JPH06234747A1994-08-23
JPH11506425A1999-06-08
JPH04180571A1992-06-26
JP2004323879A2004-11-18
Attorney, Agent or Firm:
SHIGA, Masatake et al. (JP)
Masatake Shiga (JP)
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