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Patent Searching and Data


Title:
SENSOR, APPARATUS, SYSTEM, AND METHOD FOR MANUFACTURING ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/074781
Kind Code:
A1
Abstract:
A sensor 10 comprising a structure 5 having at least four elastic parts 31-34 that are discretely disposed along a virtual circle, and a detection means 8 for detecting deformation of the structure 5, wherein: the structure 5 includes a metal component 51 having at least one elastic part 31 from among the four elastic parts 31-34, a reinforcing component 56 joined to the metal component 51, and a reinforcing component 57 joined to the metal component 51; and the metal component 51 has an upper-surface section 1 joined to the reinforcing component 56 and a lower-surface section 2 joined to the reinforcing component 57, the metal component 51 being molded by implementing a bending process on a metal member 50.

Inventors:
YAJIMA AKIRA (JP)
BENIYA YOSHIYUKI (JP)
SASAKI SHOJI (JP)
HORIGUCHI HARUHIKO (JP)
Application Number:
PCT/JP2022/040095
Publication Date:
May 04, 2023
Filing Date:
October 27, 2022
Export Citation:
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Assignee:
CANON KK (JP)
International Classes:
G01L5/16; B25J19/02; G01L5/1627; G01L5/165; G01L5/166; G01L5/169
Foreign References:
JP2012093291A2012-05-17
JPS5672323A1981-06-16
US20190025143A12019-01-24
US5445036A1995-08-29
Attorney, Agent or Firm:
ABE Takuma et al. (JP)
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