Title:
SENSOR ARRAY INTEGRATED CIRCUITS
Document Type and Number:
WIPO Patent Application WO2005095963
Kind Code:
A3
Abstract:
An apparatus includes a condensed array addressed device; and a spectroscope optically coupled to the condensed array addressed device. A method includes determining bonding and/or lack-of-bonding of a target molecule to a condensed array addressed device by characterizing a subsequent rate of electrolysis on the condensed array addressed device. A method includes fabricating a condensed array addressed device using damascene patterning.
Inventors:
DUBIN VALERY (US)
DAVID KEN (US)
BERLIN ANDREW (US)
DAVID KEN (US)
BERLIN ANDREW (US)
Application Number:
PCT/US2005/010401
Publication Date:
February 23, 2006
Filing Date:
March 25, 2005
Export Citation:
Assignee:
INTEL CORP (US)
DUBIN VALERY (US)
DAVID KEN (US)
BERLIN ANDREW (US)
DUBIN VALERY (US)
DAVID KEN (US)
BERLIN ANDREW (US)
International Classes:
G01J3/02; G01N33/53; (IPC1-7): G01N33/53; G01J3/02
Domestic Patent References:
| WO2002031463A2 | 2002-04-18 |
Foreign References:
| US20040051154A1 | 2004-03-18 | |||
| US20030082444A1 | 2003-05-01 | |||
| US6251685B1 | 2001-06-26 |
Other References:
CHAZALVIEL J -N ET AL: "Modulated infrared spectroscopy at the electrochemical interface", APPLIED SPECTROSCOPY USA, vol. 47, no. 9, September 1993 (1993-09-01), pages 1411 - 1416, XP009053691, ISSN: 0003-7028
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 10 30 November 1995 (1995-11-30)
ANDRICACOS P C ET AL: "DAMASCENE COPPER ELECTROPLATING FOR CHIP INTERCONNECTIONS", IBM JOURNAL OF RESEARCH AND DEVELOPMENT, INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW YORK, NY, US, vol. 42, no. 5, 1998, pages 567 - 574, XP000885223, ISSN: 0018-8646
DATTA M ET AL: "Fundamental aspects and applications of electrochemical microfabrication", ELECTROCHIMICA ACTA, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 45, no. 15-16, May 2000 (2000-05-01), pages 2535 - 2558, XP004206801, ISSN: 0013-4686
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 10 30 November 1995 (1995-11-30)
ANDRICACOS P C ET AL: "DAMASCENE COPPER ELECTROPLATING FOR CHIP INTERCONNECTIONS", IBM JOURNAL OF RESEARCH AND DEVELOPMENT, INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW YORK, NY, US, vol. 42, no. 5, 1998, pages 567 - 574, XP000885223, ISSN: 0018-8646
DATTA M ET AL: "Fundamental aspects and applications of electrochemical microfabrication", ELECTROCHIMICA ACTA, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 45, no. 15-16, May 2000 (2000-05-01), pages 2535 - 2558, XP004206801, ISSN: 0013-4686
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