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Patent Searching and Data


Title:
SENSOR ARRAY PACKAGING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2016/099962
Kind Code:
A3
Abstract:
A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.

Inventors:
BISHOP, James, E. (514 Harnecky Road, Newark Valley, NY, 13811, US)
JOHNSON, Allan (53 Eastwood Drive, Johnson City, NY, 13790, US)
KAPLUN, Brian (26 Jane Lacey Drive, Endicott, NY, 13760, US)
MCELWAIN, Steven, E., Jr. (111 North Arch Street, Johnson City, NY, 13790, US)
VOS, David, L. (3 Field Day Drive, Apalachin, NY, 13732, US)
Application Number:
US2015/064002
Publication Date:
September 01, 2016
Filing Date:
December 04, 2015
Export Citation:
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Assignee:
LOCKHEED MARTIN CORPORATION (6801 Rockledge Drive, Bethesda, MD, 20817, US)
International Classes:
H01J40/14; H01J5/02
Foreign References:
US20140146497A12014-05-29
US20110222307A12011-09-15
US20130235449A12013-09-12
Other References:
See also references of EP 3234981A4
Attorney, Agent or Firm:
CALDERON, Andrew, M. (Roberts Mlotkowski Safran & Cole, P.C.7918 Jones Branch Drive, Suite 50, Mclean VA, 22102, US)
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