Title:
SENSOR CHIP AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/173872
Kind Code:
A1
Abstract:
The present disclosure pertains to a sensor chip and an electronic device that enable efficient use of a carrier generated by photoelectric conversion. According to the present invention, in a semiconductor substrate, at least one avalanche multiplication region where a carrier generated by photoelectric conversion is multiplied is provided in each of a plurality of pixel regions, and light with which the semiconductor substrate is irradiated is collected by on-chip lenses. A plurality of the on-chip lenses are provided for each of the pixel regions. The present technology is applicable to, for example, a rear-surface irradiation type CMOS image sensor.
Inventors:
MATSUMOTO AKIRA (JP)
Application Number:
PCT/JP2018/009909
Publication Date:
September 27, 2018
Filing Date:
March 14, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L31/107
Foreign References:
| JP2010177392A | 2010-08-12 | |||
| JP2003218332A | 2003-07-31 | |||
| JP2015167219A | 2015-09-24 | |||
| JP2011146635A | 2011-07-28 | |||
| JP2011077467A | 2011-04-14 | |||
| JP2013143431A | 2013-07-22 | |||
| JP2014096490A | 2014-05-22 | |||
| JP2016082067A | 2016-05-16 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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