SENSOR CHIP AND FORCE SENSOR DEVICE

WIPO Patent Application WO/2019/146696

A1

This sensor chip comprises: a base plate; first supporting portions; a second supporting portion around which the first supporting portions are disposed, and which is disposed at the center of the base plate; first detection beams linking the first supporting portions that are adjacent to one another; force application points to which a force is applied, disposed on the first detection beams; and a plurality of strain detecting elements disposed at prescribed positions on the first detection beams. The plurality of strain detecting elements include first strain detecting elements formed on the first detection beams, between the first supporting portions and the force application points, wherein a second beam width, which is the width of the first detection beams in positions in which the first strain detecting elements are formed, is smaller than a first beam width, which is the width of the first detection beams in positions in which the first detection beams are linked to the first supporting portions or to the force application points. Further, the first detection beams each includes a straight-line portion, and an inclined portion linked to the straight-line portion by means of a linking portion, and the plurality of strain detecting elements include first strain detecting elements disposed on the inclined portion side of the linking portion.

YAMAGUCHI SHINYA (JP)

PCT/JP2019/002263

August 01, 2019

January 24, 2019

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MINEBEA MITSUMI INC (JP)
YAMAGUCHI SHINYA (JP)

G01L5/16; B81B3/00; H01L29/84

WO2018066557A1

2018-04-12

JP2013002942A	2013-01-07
JP2008058106A	2008-03-13
JPS6394690A	1988-04-25
US5526700A	1996-06-18

ITOH, Tadashige et al. (JP)

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