Title:
SENSOR CHIP JUNCTION STRUCTURE AND PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2018/235882
Kind Code:
A1
Abstract:
Provided is a sensor chip junction structure, wherein, in the case where the travel distances of the tip of a pressing jig (56) are, for example, 50 μm and 30 μm, a load (shear force) (N) acting on an adhesive layer (50) formed on a glass pedestal having a thickness x that is set to a range of 0.3-2.5 mm has a characteristic line situated on a characteristic line Lt1 (y=1.3889x3) or a characteristic line Lt2 (y=0.463x3), or in a region exceeding zero and not above the characteristic line Lt1 or Lt2.
Inventors:
TAKIMOTO KAZUYA (JP)
Application Number:
PCT/JP2018/023533
Publication Date:
December 27, 2018
Filing Date:
June 20, 2018
Export Citation:
Assignee:
SAGINOMIYA SEISAKUSHO INC (JP)
International Classes:
G01L9/00; H01L29/84
Foreign References:
| JP2007248232A | 2007-09-27 | |||
| JP2013011478A | 2013-01-17 | |||
| JP2014134427A | 2014-07-24 | |||
| JP2015075422A | 2015-04-20 | |||
| JP2014153073A | 2014-08-25 | |||
| US5994161A | 1999-11-30 | |||
| JP2016045172A | 2016-04-04 | |||
| JP2003247903A | 2003-09-05 | |||
| JP3987386B2 | 2007-10-10 |
Other References:
See also references of EP 3644033A4
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
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