SENSOR DEVICE AND ELECTRONIC APPARATUS

WIPO Patent Application WO/2018/131404

A1

[Problem] To reduce influence of external stress, and ensure stable detection accuracy. [Solution] The sensor device according to one embodiment of the present technology is provided with a sensor element, a package main body, a first cushioning body, and a second cushioning body. The sensor element detects an inputted physical quantity. The package main body has a first supporting body and a second supporting body. The first supporting body is electrically connected to the sensor element, and supports the sensor element. The second supporting body is electrically connected to the first supporting body, and supports the first supporting body. The first cushioning body is disposed between the sensor element and the first supporting body, and elastically connects the sensor element to the first supporting body. The second cushioning body is disposed between the first supporting body and the second supporting body, and elastically connects the first supporting body to the second supporting body.

JP2012053035	SYSTEM AND METHOD FOR ATTACHING INERTIAL SENSOR
JP2009294077	SEMICONDUCTOR PACKAGE
JP2018081036	COMPOSITE SENSOR DEVICE

MITANI SATOSHI (JP)
KABASAWA HIDETOSHI (JP)
SAITO DAISUKE (JP)

PCT/JP2017/045652

July 19, 2018

December 20, 2017

Click for automatic bibliography generation  

SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

G01C19/5783; G01P15/08; H01L29/84

WO2013046705A1	2013-04-04
WO2011161958A1	2011-12-29

JP2004271312A	2004-09-30
JP2014010131A	2014-01-20
JP2008185343A	2008-08-14
JP2007033393A	2007-02-08
JP2016130642A	2016-07-21
US20130270660A1	2013-10-17
US20100301435A1	2010-12-02

OMORI, Junichi (JP)

View/Download PDF      PDF Help

Previous Patent: ELECTRICALLY DRIVEN OIL PUMP

Next Patent: INFORMATION PROCESSING DEVICE AND METHOD, AND COMPUTER READABLE STORAGE MEDIUM