Title:
SENSOR DEVICE AND METHOD OF MANUFACTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2001/046708
Kind Code:
A1
Abstract:
A sensor device comprises a sensor substrate and a flat, silicone-coated sensor element held on the sensor substrate. The silicone coating provides good step coverage for the sensor element so that the stress on the sensor element can decrease. The coating can be formed at low temperature so that the effects on the sensor element are reduced in the manufacturing process.
Inventors:
YASUDA NAOKI (JP)
FUKAMI TATSUYA (JP)
TAGUCHI MOTOHISA (JP)
KAWANO YUJI (JP)
FUKAMI TATSUYA (JP)
TAGUCHI MOTOHISA (JP)
KAWANO YUJI (JP)
Application Number:
PCT/JP1999/007230
Publication Date:
June 28, 2001
Filing Date:
December 22, 1999
Export Citation:
Assignee:
MITSUBICHI DENKI KABUSHIKI KAI (JP)
YASUDA NAOKI (JP)
FUKAMI TATSUYA (JP)
TAGUCHI MOTOHISA (JP)
KAWANO YUJI (JP)
YASUDA NAOKI (JP)
FUKAMI TATSUYA (JP)
TAGUCHI MOTOHISA (JP)
KAWANO YUJI (JP)
International Classes:
B81C1/00; G01F1/684; G01L9/00; G01N27/12; G01P5/12; G01P15/08; G01P15/125; (IPC1-7): G01R33/06
Foreign References:
| GB2322452A | 1998-08-26 | |||
| JPH1054843A | 1998-02-24 | |||
| JPH1013616A | 1998-01-16 | |||
| JPS6062278A | 1985-04-10 | |||
| JPS6180038A | 1986-04-23 | |||
| JPS62178359A | 1987-08-05 |
Other References:
See also references of EP 1180693A4
Attorney, Agent or Firm:
Miyata, Kaneo (Marunouchi 2-chome Chiyoka-ku Tokyo, JP)
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