Title:
SENSOR DEVICE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/225841
Kind Code:
A1
Abstract:
Provided is a sensor device which is capable of assuredly maintaining a vacuum state of the interior space of the device in which a sensor element is housed. A sensor-equipped substrate 20 and a cap member 10 are joined together via a solder layer 30, and the interior space is maintained at vacuum. A joining pattern 14 has formed therein land portions 14A at the central part of the four edges of a rectangular end surface 10A in a peripheral wall part 12. A non-land portion 14B, being the area other than the land portions 14A, has a width dimension W3 smaller than the maximum width dimension W2 of the land portions 14A; meanwhile, the number of the land portions and the intervals therebetween are defined such that the solder layer 30 formed by melting a plurality of solder balls 37 is made into a completely closed loop.
Inventors:
FURUKOSHI RYOHEI
MATSUI TAKANORI
IMAMURA TETSUJI
MATSUI TAKANORI
IMAMURA TETSUJI
Application Number:
PCT/JP2018/021950
Publication Date:
December 13, 2018
Filing Date:
June 07, 2018
Export Citation:
Assignee:
HOKURIKU ELECT IND (JP)
International Classes:
G01J1/02; H01L23/02
Foreign References:
| JP2014082452A | 2014-05-08 | |||
| JP2008298708A | 2008-12-11 | |||
| JP2013183095A | 2013-09-12 | |||
| JP2016213426A | 2016-12-15 | |||
| JP2013016658A | 2013-01-24 | |||
| JPH02303676A | 1990-12-17 | |||
| US6531341B1 | 2003-03-11 | |||
| US20150253194A1 | 2015-09-10 |
Attorney, Agent or Firm:
NISHIURA Tsuguharu (JP)
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