Title:
SENSOR DEVICE AND RANGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/161687
Kind Code:
A1
Abstract:
The sensor device according to the present invention comprises: a first chip that has a first semiconductor substrate and a first wire forming layer, and has a pixel configured to include a photoelectric conversion element, and a first transfer gate element and a second transfer gate element for transferring stored charge of the photoelectric conversion element; and a second chip that has a second semiconductor substrate and a second wire forming layer. The sensor device also has a first wire electrically connected to the first transfer gate element, a second wire electrically connected to the second transfer gate element, and a third wire electrically connected to ground, wherein each of the first wire, second wire, and third wire is formed by bonding a first portion which is formed on the first wire forming layer and extends in a first direction to a second portion which is formed on the second wire forming layer and extends in the first direction. Selected drawing: FIG. 10
Inventors:
IMOTO TSUTOMU (JP)
HOSOYA MASAHIRO (JP)
OTAKE YUSUKE (JP)
HOSOYA MASAHIRO (JP)
OTAKE YUSUKE (JP)
Application Number:
PCT/JP2021/000224
Publication Date:
August 19, 2021
Filing Date:
January 06, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L25/065; G01S17/89; H01L21/60; H01L25/07; H01L25/18; H01L27/146; H04N5/369
Domestic Patent References:
| WO2018174090A1 | 2018-09-27 |
Foreign References:
| JP2009014460A | 2009-01-22 | |||
| JP2019530215A | 2019-10-17 | |||
| JP2018088488A | 2018-06-07 | |||
| JP2019033136A | 2019-02-28 | |||
| JP2018137284A | 2018-08-30 | |||
| JP2019004149A | 2019-01-10 |
Attorney, Agent or Firm:
IWATA, Masanobu et al. (JP)
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