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Patent Searching and Data


Title:
SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/150745
Kind Code:
A1
Abstract:
This sensor device is provided with a sensor element (151) and a circuit chip (160). The sensor element detects the temperature of an object to be measured and outputs a temperature signal in accordance with the temperature of the object to be measured. The circuit chip receives the input of the temperature signal and performs signal processing. The temperature signal includes a sensor error caused by the temperature difference between the object to be measured and the sensor element. When the sensor error is included in the temperature signal, a temperature difference between the sensor element and the circuit chip is produced in accordance with the sensor error. The circuit chip has a detection element (165) that detects the temperature of the circuit chip. The circuit chip corrects the temperature signal in accordance with the temperature difference between the temperature of the circuit chip detected by the detection element and the temperature of the object to be measured detected by the sensor element, and outputs a corrected temperature signal to the outside.

Inventors:
SHIMIZU Satoru (C/O DENSO CORPORATION, 1-1 Showa-ch, Kariya-city Aichi 61, 〒4488661, JP)
ONO Kazuyuki (C/O DENSO CORPORATION, 1-1 Showa-ch, Kariya-city Aichi 61, 〒4488661, JP)
Application Number:
JP2018/044245
Publication Date:
August 08, 2019
Filing Date:
November 30, 2018
Export Citation:
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Assignee:
DENSO CORPORATION (1-1 Showa-cho, Kariya-city Aichi, 61, 〒4488661, JP)
International Classes:
G01K1/20; G01K7/00; G01L9/00; G01L19/04
Foreign References:
JP2016523368A2016-08-08
JP2012159314A2012-08-23
JP2016170135A2016-09-23
JP2003344181A2003-12-03
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (11th Floor, Meieki Southside Square 21-19, Meiekiminami 1-chome, Nakamura-ku, Nagoya-sh, Aichi 03, 〒4500003, JP)
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