Title:
SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/161937
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of facilitating improvement of a degree of freedom of shape or dimension. A sensor device (1) is provided with a sensor element (2), a substrate (3), and bonding wires (6). The sensor element (2) is mounted to the substrate (3). The bonding wires (6) constitute at least a part of a connection path (60) for providing electrical connection between the sensor element (2) and the substrate (3). The bonding wires (6) are arranged to provide connection between two connection surfaces intersecting with each other.
Inventors:
NAKASHIMA KOICHIRO
UCHIDA TAKASHI
NAKAMURA YUSUKE
YAMAZAKI TOSHIO
KONISHI TOSHITSUGU
NODA NARUHITO
UCHIDA TAKASHI
NAKAMURA YUSUKE
YAMAZAKI TOSHIO
KONISHI TOSHITSUGU
NODA NARUHITO
Application Number:
PCT/JP2019/027805
Publication Date:
August 13, 2020
Filing Date:
July 12, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
G01C19/5783; G01C19/5684; H01L41/113
Foreign References:
| JP2013183083A | 2013-09-12 | |||
| JP2013183115A | 2013-09-12 | |||
| JP2000249562A | 2000-09-14 | |||
| JP2003021647A | 2003-01-24 | |||
| US20160027992A1 | 2016-01-28 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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