Title:
SENSOR DEVICE AND SENSOR
Document Type and Number:
WIPO Patent Application WO/2021/095658
Kind Code:
A1
Abstract:
Provided is a sensor device for which freedom with respect to the shape or dimensions thereof can easily be improved. A sensor device (1) comprises a sensor element (2), a support member (4), a substrate (3), and bonding wires (6). The support member (4) is electrically connected to the sensor element (2). The substrate (3) is electrically connected to the support member (4). The bonding wires (6) form at least a portion of a connection path (60) that electrically connects the sensor element (2) and the support member (4). The substrate (3) and a disposition member on which the sensor element (2) is disposed intersect. The sensor element (2) and the support member (4) are separated.
Inventors:
UEDA HIDEKI
NAKAMURA YUSUKE
NAKASHIMA KOICHIRO
UCHIDA TAKASHI
YAMAZAKI TOSHIO
FUJII HIROYUKI
NARA CHIKARA
NAKAMURA YUSUKE
NAKASHIMA KOICHIRO
UCHIDA TAKASHI
YAMAZAKI TOSHIO
FUJII HIROYUKI
NARA CHIKARA
Application Number:
PCT/JP2020/041549
Publication Date:
May 20, 2021
Filing Date:
November 06, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L23/12; G01D11/30; H01L25/00
Foreign References:
| JP2009122049A | 2009-06-04 | |||
| JPH11211750A | 1999-08-06 | |||
| JPS6235476U | 1987-03-02 | |||
| JP2002098709A | 2002-04-05 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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