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Title:
SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/070113
Kind Code:
A1
Abstract:
A sensor device (2) is provided with a plurality of substrates (3) disposed side by side in a substrate thickness direction, and a plurality of sensors (4) disposed on the plurality of substrates (3). When the plurality of substrates (3) are viewed in plan, the plurality of sensors (4) are disposed at different positions.

Inventors:
TERAO FUMITAKE (JP)
SHIOSAKI SHOICHI (JP)
TSUKANO MASAHITO (JP)
TAKEDA SHOMA (JP)
Application Number:
PCT/JP2023/024769
Publication Date:
April 04, 2024
Filing Date:
July 04, 2023
Export Citation:
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Assignee:
YOKOGAWA ELECTRIC CORP (JP)
International Classes:
G01N27/82; G01R33/02; G01V3/00
Domestic Patent References:
WO2018199067A12018-11-01
WO2012111851A12012-08-23
Foreign References:
US20140002072A12014-01-02
US5659248A1997-08-19
US20180052065A12018-02-22
US20100139081A12010-06-10
JP2021177170A2021-11-11
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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