Title:
SENSOR ELEMENT AND METHOD FOR MANUFACTURING SAME, AND SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/082646
Kind Code:
A1
Abstract:
Provided is a sensor element which can be manufactured without needing to use hydrofluoric acid or a hot phosphoric acid solution. A sensor element 100 provided with a base member 10 and a semiconductor chip 20 bonded to the base member 10. The semiconductor chip 20 is equipped with a semiconductor substrate 21, a support film 22 provided on a surface 21a of the semiconductor substrate 21, a substrate chamber 23 provided in a concave form in the semiconductor substrate 21 so as to form a void adjacent to an element region 22A in the support film 22, an insulating layer 24 provided on a rear surface 21b of the semiconductor substrate 21, and a bonding layer 25 provided between the insulating layer 14 and the base member 10. The insulating layer 24 includes a silicon oxynitride film and/or a silicon oxide film. The bonding layer 25 contains a low-melting-point glass.
Inventors:
AOYAGI TAKUYA (JP)
ANDO RYO (JP)
OHTA KAZUHIRO (JP)
SUZUKI KENGO (JP)
ONUKI HIROSHI (JP)
ONOSE YASUO (JP)
NAKANO HIROSHI (JP)
ANDO RYO (JP)
OHTA KAZUHIRO (JP)
SUZUKI KENGO (JP)
ONUKI HIROSHI (JP)
ONOSE YASUO (JP)
NAKANO HIROSHI (JP)
Application Number:
PCT/JP2018/037656
Publication Date:
May 02, 2019
Filing Date:
October 10, 2018
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
G01L9/00; G01N25/62; H01L29/84
Foreign References:
| JPS60230028A | 1985-11-15 | |||
| JPS5933883A | 1984-02-23 | |||
| JP2016011889A | 2016-01-21 | |||
| JP2016176895A | 2016-10-06 |
Attorney, Agent or Firm:
TODA Yuji (JP)
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