Title:
SENSOR FIXING STRUCTURE, WEARABLE DEVICE, AND HOT MELT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/052353
Kind Code:
A1
Abstract:
A sensor fixing structure (100), a wearable device, and a hot melt apparatus (200). The sensor fixing structure (100) comprises: a support (10), connection arms (15) being protrudingly provided on the support (10), and the connection arms (15) being hot melt protrusions; and a sensor structure (30). The support (10) covers the sensor structure (30); each connection arm (15) comprises a connection section (151) and an abutment section (153); the connection section (151) has one end connected to the support (10), and the other end connected to the abutment section (153); the abutment section (153) is located on the side of the sensor structure (30) facing away from the support (10), and abuts the sensor structure (30) against the support (10); the connection arm (15) forms the abutment section (153) by means of hot melting. The sensor fixing structure (100) has a good packaging effect and a smaller overall volume.
Inventors:
ZHONG QIANG (CN)
Application Number:
PCT/CN2020/136347
Publication Date:
March 17, 2022
Filing Date:
December 15, 2020
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
G01V8/10
Foreign References:
| CN112051619A | 2020-12-08 | |||
| CN209358745U | 2019-09-06 | |||
| CN211280988U | 2020-08-18 | |||
| CN107512004A | 2017-12-26 | |||
| CN107366711A | 2017-11-21 | |||
| US5416476A | 1995-05-16 |
Download PDF:
Previous Patent: COMPOSITE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Next Patent: MEMORY PACKAGE CHIP AND SIGNAL PROCESSING METHOD THEREFOR
Next Patent: MEMORY PACKAGE CHIP AND SIGNAL PROCESSING METHOD THEREFOR