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Patent Searching and Data


Title:
SENSOR AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/100545
Kind Code:
A1
Abstract:
A sensor is provided which can prevent leakage of sealing resin from between a housing and a clamp. This sensor 1 is provided with a cylindrical housing 10 which has an opening 11 formed at one end, an electronic component which is housed in the housing 10, a cylindrical clamp 20 which is inserted at one end into the housing 10 from the opening 11, and a sealing resin 51 which seals the gap between the inner wall 10a of the housing 10 and the outer wall 20a of the clamp 20. On the outer wall 20a, the clamp 20 has a rib 24 which rises towards the inner wall 10a of the housing 10. The rib 24 includes an apex 25 and a sloped surface 26b which extends from the apex 25 towards the other end of the clamp 20 and which intersects the outer wall 20a of the clamp 20. The sealing resin 51, which exudes from between the inner wall 10a of the housing 10 and the apex 25 and which is positioned on the sloped surface 26b, has a recess 51a resulting from surface tension.

Inventors:
NAKAYAMA YUSUKE (JP)
INOUE DAISUKE (JP)
USHIRO YUKI (JP)
SANDA TAKAAKI (JP)
KATSURA HIROTO (JP)
UEHARA NAOMI (JP)
NAKAMURA MASAKI (JP)
IMAIZUMI TOYOHIRO (JP)
Application Number:
PCT/JP2019/041641
Publication Date:
May 22, 2020
Filing Date:
October 24, 2019
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01H36/00; H01H11/00; H05K5/00; H05K5/02
Foreign References:
JPH0992105A1997-04-04
JPH0660763A1994-03-04
JPH0992105A1997-04-04
Other References:
See also references of EP 3882943A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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