Title:
SENSOR MODULE, ACTIVE CONTROL DEVICE, ACTIVE CONTROL METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/021735
Kind Code:
A1
Abstract:
The present invention makes it possible to perform active control easily at low cost, for example. This sensor module comprises: a first sensor unit which is installed on an object, and which measures sound pressure; a second sensor unit which is installed on the object and which measures vibration; and a signal processing unit which uses an output signal from the first sensor and an output signal from the second sensor unit to output, as two module signals, a signal of a vibration component of the object, and a signal of a sound pressure component obtained by removing the vibration component of the object from the output signal from the first sensor unit.
Inventors:
HAYASHI SHIGETOSHI (JP)
ITABASHI TETSUNORI (JP)
MAGARIYACHI TETSU (JP)
KURODA YOSHIYUKI (JP)
SATO KOYA (JP)
ITABASHI TETSUNORI (JP)
MAGARIYACHI TETSU (JP)
KURODA YOSHIYUKI (JP)
SATO KOYA (JP)
Application Number:
PCT/JP2022/007158
Publication Date:
February 23, 2023
Filing Date:
February 22, 2022
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
H04R3/00; G10K11/178
Foreign References:
| JP2000155048A | 2000-06-06 | |||
| JP2011176534A | 2011-09-08 | |||
| JP2017067763A | 2017-04-06 | |||
| JPH0756580A | 1995-03-03 | |||
| JP2017161633A | 2017-09-14 |
Attorney, Agent or Firm:
SUGIURA PATENT OFFICE et al. (JP)
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