Title:
SENSOR MODULE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/080154
Kind Code:
A1
Abstract:
A sensor module according to one embodiment of the present disclosure is provided with: a sensor substrate having a light receiving surface on which a plurality of light receiving elements are arranged; and a light transmission substrate which is provided on the light receiving surface and which has, on a surface on the reverse side from a surface facing the light receiving surface of the sensor substrate, a flat region having a flat surface and a recesses-and-protrusions region having recesses or protrusions formed therein.
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Inventors:
NAGATA MASAYA (JP)
Application Number:
PCT/JP2019/039368
Publication Date:
April 23, 2020
Filing Date:
October 04, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; G01J1/04; H01L31/0232; H04N5/369
Domestic Patent References:
| WO2006109638A1 | 2006-10-19 |
Foreign References:
| JP2007158751A | 2007-06-21 | |||
| JP2010045463A | 2010-02-25 | |||
| JP2002006115A | 2002-01-09 | |||
| JP2004163960A | 2004-06-10 | |||
| JP2010245292A | 2010-10-28 | |||
| JP2018194121A | 2018-12-06 |
Other References:
See also references of EP 3869562A4
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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