Title:
SENSOR MODULE AND FORCE SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/145576
Kind Code:
A1
Abstract:
This sensor module comprises: a substrate; a sensor chip that is mounted on one surface of the substrate and that detects displacement in a prescribed axial direction; a bonding wire for electrically connecting a first electrode, which is formed on the one surface of the substrate, and a second electrode of the sensor chip; and a protective frame that is disposed at the peripheral edge of the one surface of the substrate so as to be separated from the bonding wire.
Inventors:
YAMAGUCHI SHINYA (JP)
Application Number:
PCT/JP2023/001359
Publication Date:
August 03, 2023
Filing Date:
January 18, 2023
Export Citation:
Assignee:
MINEBEA MITSUMI INC (JP)
International Classes:
G01L5/162
Domestic Patent References:
| WO2003010651A1 | 2003-02-06 |
Foreign References:
| US20130247690A1 | 2013-09-26 | |||
| JP2016217804A | 2016-12-22 | |||
| JP2008190865A | 2008-08-21 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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