Title:
SENSOR MODULE AND SENSOR MODULE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/095703
Kind Code:
A1
Abstract:
Disclosed is a sensor module that can maintain data security by not allowing card data output from a magnetic head to be stolen by a third party. In a sensor module (10A), the front end of a flexible substrate (13), on which connection terminals, a resistance element, an A/D converter chip, and a digital IC are mounted, is accommodated, in a state folded into four in one direction, inside a housing (11) of a specified volume, and the connection terminals, resistance element, A/D converter chip, and digital IC are affixed, together with the front end of the flexible substrate (13), to the housing (11) by means of an epoxy resin (28) that fills the interior of the housing (11).
Inventors:
ISUYAMA YASUO (BR)
Application Number:
PCT/JP2010/052498
Publication Date:
August 26, 2010
Filing Date:
February 19, 2010
Export Citation:
Assignee:
CIS ELETRONICA IND E COM LTDA (BR)
ISUYAMA YASUO (BR)
ISUYAMA YASUO (BR)
International Classes:
G11B5/105; G11B21/02
Foreign References:
| JP2002189987A | 2002-07-05 | |||
| JPH01143186U | 1989-10-02 | |||
| JP2001043661A | 2001-02-16 | |||
| JP2008293628A | 2008-12-04 |
Attorney, Agent or Firm:
KOBAYASHI YOSHITAKA (JP)
Yoshitaka Kobayashi (JP)
Yoshitaka Kobayashi (JP)
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