Title:
SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2014/073108
Kind Code:
A1
Abstract:
A sensor module (10) is configured by having a vibrating section (11) and a control circuit section (12) separated from each other, and the vibrating section (11) and a fixing member (14) are integrated with each other by adhering the vibrating section on the adhesive surface (14a) of the fixing member. The vibrating section (11) is fixed in a hole (3) in a bumper (2) by adhering the fixing member (14) on the front surface of the bumper (2), and the control circuit section (12) is attached to the rear surface of the bumper (2), and is connected using wiring (13).
Inventors:
SUZUKI RYOTARO (JP)
INOUE SATORU (JP)
NISHIMOTO YUKIO (JP)
INOUE SATORU (JP)
NISHIMOTO YUKIO (JP)
Application Number:
PCT/JP2012/079264
Publication Date:
May 15, 2014
Filing Date:
November 12, 2012
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
SUZUKI RYOTARO (JP)
INOUE SATORU (JP)
NISHIMOTO YUKIO (JP)
SUZUKI RYOTARO (JP)
INOUE SATORU (JP)
NISHIMOTO YUKIO (JP)
International Classes:
G01S7/521; B60R19/48; B60R21/00; G01S7/03; G01S15/931
Foreign References:
| JPH10123236A | 1998-05-15 | |||
| JPH1144752A | 1999-02-16 | |||
| JP2006250564A | 2006-09-21 | |||
| JP2009043473A | 2009-02-26 | |||
| JP2006298010A | 2006-11-02 | |||
| JPH0742726U | 1995-08-11 | |||
| JP2005308639A | 2005-11-04 | |||
| JPH029888U | 1990-01-22 |
Attorney, Agent or Firm:
TAZAWA, Hideaki et al. (JP)
Hideaki Tazawa (JP)
Hideaki Tazawa (JP)
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