Title:
SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2021/161919
Kind Code:
A1
Abstract:
This sensor module is provided with a housing, a substrate unit, an external connector, and a joining member. The housing has a first case and a second case that is welded to the first case. The substrate unit has a sensor element and is disposed in the housing. The external connector is provided to the second case and has an elastically deformable terminal part that is electrically connected to the substrate unit. The joining member is mounted to the substrate unit and is welded to the housing.
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Inventors:
YAMASHITA YUTARO (JP)
Application Number:
PCT/JP2021/004339
Publication Date:
August 19, 2021
Filing Date:
February 05, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/225; G03B15/00; G03B17/02
Foreign References:
| US20180098033A1 | 2018-04-05 | |||
| JP2018173431A | 2018-11-08 | |||
| US20120019940A1 | 2012-01-26 | |||
| KR20180110992A | 2018-10-11 | |||
| JP2017223775A | 2017-12-21 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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