Title:
SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/211112
Kind Code:
A1
Abstract:
A sensor module according to an embodiment of the present disclosure includes a pressure sensing part for sensing pressure; at least one or a plurality of PCB substrates for receiving the pressure signal sensed by the pressure sensing part, processing the pressure signal, and then outputting the signal; and a case accommodating the at least one or a plurality of PCB substrates and coupled to an upper end of the pressure sensing part; in which the pressure sensing part includes a sensing port in which a communication hole for pressure transmission is formed; and a pressure sensing element placed on an inner upper side of the sensing port and sensing a change in pressure transmitted through the communication hole; the pressure sensing element includes a diaphragm including a horizontal sensing surface and a support part extending vertically from an edge of the sensing surface; and one or more strain gauges placed on the sensing surface to sense a change in pressure transmitted through the communication hole; and the outer circumferential surface of the support part is formed with a groove recessed to a predetermined depth.
Inventors:
HWANG DO ICK (KR)
LEE SEUNG YOUNG (KR)
LEE HO JUNG (KR)
KIM JIN WOONG (KR)
LEE SEUNG YOUNG (KR)
LEE HO JUNG (KR)
KIM JIN WOONG (KR)
Application Number:
PCT/KR2023/005607
Publication Date:
November 02, 2023
Filing Date:
April 25, 2023
Export Citation:
Assignee:
AUTONICS CORP (KR)
International Classes:
G01L9/00; G01L9/04; G01L19/00; G01L19/14
Foreign References:
| JPH1194673A | 1999-04-09 | |||
| KR20150048954A | 2015-05-11 | |||
| JPH1046239A | 1998-02-17 | |||
| KR20160038775A | 2016-04-07 | |||
| JP2006038538A | 2006-02-09 | |||
| CN109100080A | 2018-12-28 | |||
| US20170328798A1 | 2017-11-16 |
Attorney, Agent or Firm:
KIM, Ki Moon (KR)
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