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Patent Searching and Data


Title:
SENSOR MOUNTING METHODOLOGY
Document Type and Number:
WIPO Patent Application WO/2013/003042
Kind Code:
A3
Abstract:
Methods and devices for mounting a sensor are presented herein. A temperature sensor assembly for a capacitor bank is disclosed that includes two opposing substrates, and a plurality of contact temperature sensors attached to each substrate. Each temperature sensor is configured to directly contact a surface of one of the capacitor cans in the capacitor bank and therefrom generate a signal indicative of the temperature of the capacitor can. A biasing member attaches the two substrates together. The biasing member is configured to selectively contract, such that the width of the sensor assembly is less than the gap distance between adjacent sets of tandem capacitor cans and the sensor assembly can insert between the sets of capacitor cans, and expand, such that the width of the sensor assembly is greater than the gap distance and the sensor assembly is tensioned against and thereby secured between the sets of capacitor cans.

Inventors:
FARAGO JEFFREY J (US)
PEREZ MARCELO (US)
HARDING STEWART J (CA)
Application Number:
PCT/US2012/042203
Publication Date:
July 11, 2013
Filing Date:
June 13, 2012
Export Citation:
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Assignee:
SCHNEIDER ELECTRIC USA INC (US)
FARAGO JEFFREY J (US)
PEREZ MARCELO (US)
HARDING STEWART J (CA)
International Classes:
G01K1/14; G01K1/02; G01K13/00
Foreign References:
US5285054A1994-02-08
US20060231546A12006-10-19
JPS61219841A1986-09-30
JPH11153495A1999-06-08
Attorney, Agent or Firm:
SWINDELLS, Justin, D. et al. (300 S. Riverside Plaza 16th floo, Chicago Illinois, US)
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