Title:
SENSOR PACKAGE, SENSOR PACKAGE ATTACHMENT METHOD, SET INCLUDING SENSOR PACKAGE AND CURING AGENT, AND BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/191017
Kind Code:
A1
Abstract:
The present invention pertains to a sensor package that comprises a first substrate and an optical fiber having an FBG sensor unit disposed on the first substrate. The sensor package has a resin part located on the first substrate, a first tackifier layer that is located on the first substrate and that is for attaching an object to the first substrate, and a tacky adhesive layer that is located, on the resin part, on a surface on the opposite side of the first substrate. The FBG sensor unit in the optical fiber is in contact with the resin part and is held by the tacky adhesive layer. The present invention also pertains to: a method for attaching the sensor package; a set including the sensor package and a curing agent; and a bonded structure.
Inventors:
TANAKA AKIKO (JP)
HAMADA CHIE (JP)
SUZUKI YUTO (JP)
WATANABE MASAHIRO (JP)
FUKUMOTO SHINTARO (JP)
NISHIDO TAKAYUKI (JP)
HAMADA CHIE (JP)
SUZUKI YUTO (JP)
WATANABE MASAHIRO (JP)
FUKUMOTO SHINTARO (JP)
NISHIDO TAKAYUKI (JP)
Application Number:
PCT/JP2023/013444
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
IHI INSPECTION AND INSTR CO LTD (JP)
IHI INSPECTION AND INSTR CO LTD (JP)
International Classes:
G01D5/353; C09J5/04; C09J201/00; G01D11/30
Domestic Patent References:
| WO2021054350A1 | 2021-03-25 |
Foreign References:
| JP2010519517A | 2010-06-03 | |||
| JP2006208264A | 2006-08-10 | |||
| KR20210097551A | 2021-08-09 |
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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