Title:
SENSOR PACKAGE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2013/165052
Kind Code:
A1
Abstract:
The present invention relates to a sensor package and a manufacturing method therefor. The sensor package comprises a can-type cover, a substrate on which a MEMS transducer and a semiconductor circuit device are mounted, and a foreign substance inflow-prevention member. The cover is made of a metallic material in a single layer and has an acoustic hole or a pressure hole for receiving an acoustic signal or a sound pressure signal on one upper lateral surface thereof. The foreign substance inflow-prevention member covers the acoustic hole or the pressure hole by being attached to the upper inner surface of the cover so as to prevent a foreign substance from flowing through the acoustic hole or the pressure hole. According to the present invention, since the foreign substance inflow-prevention member is provided to the upper inner surface of the cover, the inflow of a foreign substance from the acoustic hole or the pressure hole can be prevented, a manufacturing method is simplified, and mass and automated production are possible. Furthermore, it is also possible to prevent damage to the foreign substance inflow-prevention member due to high temperatures during a subsequent reflow soldering process, and to minimize sensitivity degradation of an acoustic signal or a sound pressure signal.
Inventors:
KIM TAE WON (KR)
KIM SUNG MIN (KR)
CHOI JI WON (KR)
PARK KYUNG WON (KR)
NO KYOUG HWAN (KR)
KIM SUNG MIN (KR)
CHOI JI WON (KR)
PARK KYUNG WON (KR)
NO KYOUG HWAN (KR)
Application Number:
PCT/KR2012/005830
Publication Date:
November 07, 2013
Filing Date:
July 20, 2012
Export Citation:
Assignee:
PARTRON CO LTD (KR)
KIM TAE WON (KR)
KIM SUNG MIN (KR)
CHOI JI WON (KR)
PARK KYUNG WON (KR)
NO KYOUG HWAN (KR)
KIM TAE WON (KR)
KIM SUNG MIN (KR)
CHOI JI WON (KR)
PARK KYUNG WON (KR)
NO KYOUG HWAN (KR)
International Classes:
H04R19/04; H01L25/16
Foreign References:
| KR100925558B1 | 2009-11-05 | |||
| JP2006222641A | 2006-08-24 | |||
| KR200415820Y1 | 2006-05-08 | |||
| KR20110072991A | 2011-06-29 | |||
| KR100675027B1 | 2007-01-30 |
Attorney, Agent or Firm:
OH, JONG HWAN (KR)
오종환 (KR)
오종환 (KR)
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