SENSOR PACKAGE AND METHOD FOR ATTACHING SENSOR PACKAGE

Title:

SENSOR PACKAGE AND METHOD FOR ATTACHING SENSOR PACKAGE

Document Type and Number:

WIPO Patent Application WO/2021/054350

Kind Code:

A1

Abstract:

The present invention pertains to a sensor package adhered to a target object, the sensor package comprising: a first substrate; an FBG sensor; a resin part and a first adhesive layer which are located on the first substrate; and a sticky adhesive layer located on a surface on the reverse side of the first substrate in the resin part, wherein the FBG sensor is held by the resin part.

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Inventors:

TANAKA AKIKO (JP)
ISHIGURO SHIGEKI (JP)
KIRA YOSHIKO (JP)
FUKUMOTO SHINTARO (JP)
IMAGAWA SHUN (JP)
NISHIDO TAKAYUKI (JP)

Application Number:

PCT/JP2020/035044

Publication Date:

March 25, 2021

Filing Date:

September 16, 2020

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)
IHI INSPECTION AND INSTR CO LTD (JP)

International Classes:

G01D11/30; G01D5/353

Foreign References:

JP2010519517A	2010-06-03
JP2002090233A	2002-03-27
JP2002311253A	2002-10-23
JP2009503449A	2009-01-29
JP2006208264A	2006-08-10
JP2016194441A	2016-11-17
JP2009300096A	2009-12-24
JPH0149795B2	1989-10-26
JP2019168780A	2019-10-03

Other References: