SENSOR PACKAGE - MATSUSHITA ELECTRIC WORKS LTD

Title:

SENSOR PACKAGE

Document Type and Number:

WIPO Patent Application WO/2003/102601

Kind Code:

A1

Abstract:

A sensor package (P) is of a type that is surface-mounted on a printed board (200) and comprises a case (1) in which a semiconductor acceleration sensor chip (100) having output pads (101) is housed. The case (1) has a bottom wall (10) that is demarcated into a central area (10a) where the semiconductor acceleration sensor chip (100) is held and a peripheral area (10b). Output electrodes (15) are formed on the outer surface of the peripheral area (10b) and electrically connected to the output pads (101). By soldering the output electrodes (15) to the printed board (200), the output of the semiconductor acceleration sensor chip (100) is electrically connected to an electric circuit of the printed board (200) through the output electrodes (15), and the sensor package (P) is mechanically held on the printed board. In the inner surface of the bottom wall (10), a groove (12) is formed between the central area (10a) and the peripheral area (10b).

Inventors:

FURUKUBO EIICHI (JP)
HORI MASAMI (JP)
NOHARA KAZUYA (JP)

Application Number:

PCT/JP2003/006784

Publication Date:

December 11, 2003

Filing Date:

May 29, 2003

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MATSUSHITA ELECTRIC WORKS LTD (JP)
FURUKUBO EIICHI (JP)
HORI MASAMI (JP)
NOHARA KAZUYA (JP)

International Classes:

G01P1/02; G01P15/08; G01P15/125; H01L29/84; H05K3/34; (IPC1-7): G01P15/08

Foreign References:

JP2000046859A	2000-02-18
JPH05333056A	1993-12-17
US5406454A	1995-04-11
JPH1062446A	1998-03-06
US6448624B1	2002-09-10
JPH11281667A	1999-10-15
JPH11260960A	1999-09-24
JPH06289048A	1994-10-18
JP2001337104A	2001-12-07

Other References: