Title:
SENSOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2017/052089
Kind Code:
A1
Abstract:
Disclosed is a sensor package. A sensor package according to the present invention comprises: a base substrate; a sensor chip above the upper surface of the base substrate; a glass cover above the upper surface of the sensor chip; a bezel part surrounding the glass cover; and resin material around the sensor chip to adhere to the sensor chip and the bottom surface of the glass cover.
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Inventors:
LEE SU GIL (KR)
Application Number:
PCT/KR2016/009578
Publication Date:
March 30, 2017
Filing Date:
August 29, 2016
Export Citation:
Assignee:
PARTRON CO LTD (KR)
International Classes:
G01D21/00; G01D5/00; G01D11/24; G01D11/26; G01J1/02; G01K1/00; G01K1/08; G01L19/00; G01L19/14; G01V8/12
Foreign References:
| JPS59123259A | 1984-07-17 | |||
| KR20140016023A | 2014-02-07 | |||
| JPH11340480A | 1999-12-10 | |||
| JP2007311454A | 2007-11-29 | |||
| KR20100017833A | 2010-02-16 |
Attorney, Agent or Firm:
CHOI, Hak Hyun (KR)
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