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Title:
SENSOR AND SENSOR-PRODUCING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/012909
Kind Code:
A1
Abstract:
The sensor according to an embodiment of the present disclosure is provided with: a substrate; a sensor element placed on the substrate; a wire electrically connected to the sensor element; and a stretchable member covering the sensor element and the wire, the stretchable member being bonded to the substrate.

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Inventors:
KATSUHARA MAO (JP)
Application Number:
PCT/JP2018/022731
Publication Date:
January 17, 2019
Filing Date:
June 14, 2018
Export Citation:
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Assignee:
SONY CORP (JP)
International Classes:
H05K3/28; B81C3/00; H05K1/02
Domestic Patent References:
WO2017065272A12017-04-20
Foreign References:
US20080257589A12008-10-23
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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