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Patent Searching and Data


Title:
SENSOR SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/225525
Kind Code:
A1
Abstract:
Provided is a sensor system with which it is possible to perform ultrasonic examination of wall thinning, cracking, etc., of a pipe or container covered by a thick-walled cover member, without removing the cover member. This sensor system (1), which is used in non-destructive examination, has: a sensor (20) attached to the surface of an object to be examined (42); a sensor coil (21) electrically connected to the sensor (20) by a first cable (22); a first electromagnetic-wave-shielding member (23) arranged between the surface of the object to be examined (42) and the sensor coil (21); a sensor-side coil (3) arranged so as to face the sensor coil (21) across a gap, the sensor-side coil (3) being capable of coupling by electromagnetic inductance; and a probe-side coil (2) arranged so as to be set apart from the sensor-side coil (3), the probe-side coil (2) being electrically connected by a second cable (4).

Inventors:
TAMURA AKINORI (JP)
KANNO SATOSHI (JP)
WILCOX PAUL (GB)
CROXFORD ANTHONY (GB)
ZHONG CHENGHUAN (GB)
Application Number:
PCT/JP2018/020043
Publication Date:
December 13, 2018
Filing Date:
May 24, 2018
Export Citation:
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Assignee:
HITACHI GE NUCLEAR ENERGY LTD (JP)
INDUCTOSENSE LTD (GB)
UNIV BRISTOL (GB)
International Classes:
G01N29/04; G01N29/22
Domestic Patent References:
WO2016207604A12016-12-29
Foreign References:
GB2523266A2015-08-19
JP2017096857A2017-06-01
JP2016001136A2016-01-07
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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