Title:
SENSOR WITH LOW HEAT RESISTANCE
Document Type and Number:
WIPO Patent Application WO/2021/075248
Kind Code:
A1
Abstract:
[Problem] To provide a sensor with low heat resistance, said sensor having excellent drip proof properties and excellent dust proof properties, while exhibiting excellent chemical resistance. [Solution] A sensor with low heat resistance, said sensor comprising: a sensor main body part that is obtained by arranging a sensor unit in a case; and a cable that is electrically connected to the sensor unit of the sensor main body part. With respect to this sensor with low heat resistance, the case of the sensor main body part is formed of a fluororesin; the cable is covered by a tube that is formed of a fluororesin; and the case and the tube are integrated by thermally bonding the connected portions of the case and the tube.
Inventors:
SATOH HISATAKA (JP)
KOMEDA TETSUYA (JP)
KOMEDA TETSUYA (JP)
Application Number:
PCT/JP2020/036579
Publication Date:
April 22, 2021
Filing Date:
September 28, 2020
Export Citation:
Assignee:
VALQUA LTD (JP)
International Classes:
G01D11/24; G01P15/08
Domestic Patent References:
| WO2019167865A1 | 2019-09-06 |
Foreign References:
| JPH01170929U | 1989-12-04 | |||
| JP2004009318A | 2004-01-15 | |||
| JP2005285501A | 2005-10-13 | |||
| JP2008140867A | 2008-06-19 | |||
| JP2012032363A | 2012-02-16 | |||
| JP2017092192A | 2017-05-25 | |||
| US20170159970A1 | 2017-06-08 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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