Title:
SENSOR
Document Type and Number:
WIPO Patent Application WO/2018/109911
Kind Code:
A1
Abstract:
This sensor 9 is provided with a sensor head 91 that is inserted into a sensor attachment hole 61a and a ridge 911 that is provided on the outer peripheral surface of the sensor head 91 so as to come into contact with the inner peripheral surface of the sensor attachment hole 61a, protrudes in the radial direction of the sensor head 91 while extending in the axial direction of the sensor head 91, and supports the sensor head 91. As a result of this configuration, even if the sensor 9 is attached to a sensor attachment body that is subject to high-acceleration vibration and/or shock, it is possible to suppress the vibration of the sensor and thereby suppress sensor 9 faults.
Inventors:
YOSHIDA HIROYUKI (JP)
SHOJI KAZUICHI (JP)
IWAMOTO HIRONORI (JP)
SHOJI KAZUICHI (JP)
IWAMOTO HIRONORI (JP)
Application Number:
PCT/JP2016/087428
Publication Date:
June 21, 2018
Filing Date:
December 15, 2016
Export Citation:
Assignee:
APPLIED ELECTRONICS CORP (JP)
TOMONARI KENGO (JP)
TOMONARI KENGO (JP)
International Classes:
G01P1/02
Domestic Patent References:
| WO2011012399A1 | 2011-02-03 |
Foreign References:
| JP2016156624A | 2016-09-01 | |||
| JP2003262644A | 2003-09-19 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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