Title:
SENSOR
Document Type and Number:
WIPO Patent Application WO/2018/135211
Kind Code:
A1
Abstract:
This sensor has a sensor substrate and an upper lid substrate joined to the upper surface of the sensor substrate. The sensor substrate has a fixed part, a deformable beam part that is connected to the fixed part, and a weight part that is connected to the beam part so as to be movable in relation to the fixed part. The upper lid substrate has a first part that includes silicon and a second part that is joined to the first part and includes glass. The first part has a protruding part that protrudes more toward the sensor substrate than the second part.
Inventors:
IMANAKA TAKASHI
TAJI SHOICHI
HIRAOKA SOICHIRO
MORINAKA KATSUYA
TAJI SHOICHI
HIRAOKA SOICHIRO
MORINAKA KATSUYA
Application Number:
PCT/JP2017/045414
Publication Date:
July 26, 2018
Filing Date:
December 19, 2017
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
G01C19/5747; B81B7/02; G01C19/5769; H01L29/84
Foreign References:
| JPH06347475A | 1994-12-22 | |||
| JP2013015529A | 2013-01-24 | |||
| JP2014004676A | 2014-01-16 | |||
| JP2008060382A | 2008-03-13 | |||
| JP2008134222A | 2008-06-12 | |||
| JP2015141103A | 2015-08-03 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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