Title:
SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/179573
Kind Code:
A1
Abstract:
In a sensor for which a metal lid is adhered to a metal case, it is possible to improve heat dissipation. This sensor 1 comprises: a metal case 10 that houses a circuit board 40 electrically connected to a sensor element, and for which are provided an opening 15 and an edge part 11 that defines the opening 15; and a metal lid 20 that is adhered to the edge part 11 so as to cover the opening 15. One or more recesses 14 are provided on at least one of the edge part 11 and the metal lid 20, and the metal lid 20 is adhered to the edge part 11 by the portion of an adhesive agent 50 filled inside the recess 14 that is positioned at the area of the open end of the recess 14.
Inventors:
OHARA HIDEKAZU (JP)
MIYATA TSUYOSHI (JP)
MIYATA TSUYOSHI (JP)
Application Number:
PCT/JP2020/007689
Publication Date:
September 10, 2020
Filing Date:
February 26, 2020
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01H9/02; H01H35/00; H01L31/12; H05K5/00; H05K5/04; H05K5/06
Foreign References:
| JP2017157487A | 2017-09-07 | |||
| JP2006524910A | 2006-11-02 | |||
| JP2010272561A | 2010-12-02 | |||
| JP2018152227A | 2018-09-27 | |||
| JP6394626B2 | 2018-09-26 |
Other References:
See also references of EP 3937201A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Download PDF:
Previous Patent: DIAMOND-COATED TOOL
Next Patent: DIAGNOSTIC MACHINE INSPECTION SYSTEM AND DIAGNOSTIC MACHINE INSPECTION METHOD
Next Patent: DIAGNOSTIC MACHINE INSPECTION SYSTEM AND DIAGNOSTIC MACHINE INSPECTION METHOD