Title:
SEPARABLE TYPE CONDUCTIVE CONTACT STRUCTURE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/184768
Kind Code:
A1
Abstract:
The present invention provides a separable type conductive contact structure and a preparation method therefor. Conductive interconnection which is repeatedly pluggable is realized by means of a contact surface of a suspended flexible conductive metal thin film and a conductive protrusion, and repeatable plugging of a vertical interconnection structure can be realized while high integration density is met, thereby realizing repeated use of expensive devices such as a VLSI signal processing circuit chip, and reducing consumable costs.
Inventors:
WANG JIN (CN)
Application Number:
PCT/CN2019/078745
Publication Date:
October 03, 2019
Filing Date:
March 19, 2019
Export Citation:
Assignee:
QITAN TECH LTD BEIJING (CN)
International Classes:
H01L21/768; H01L27/146
Foreign References:
| US20060028222A1 | 2006-02-09 | |||
| US4778326A | 1988-10-18 | |||
| US20150318251A1 | 2015-11-05 | |||
| CN107833907A | 2018-03-23 |
Attorney, Agent or Firm:
BEIJING LINKTEC IP LAW FIRM (SPECIAL GENERAL PARTNERSHIP) (CN)
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