SEPARATELY PACKAGED BRIDGE MAGNETIC-FIELD ANGLE SENSOR - JIANGSU MULTIDIMENSIONAL TECHNOLOGY CO LTD

Title:

SEPARATELY PACKAGED BRIDGE MAGNETIC-FIELD ANGLE SENSOR

Document Type and Number:

WIPO Patent Application WO/2012/116659

Kind Code:

A1

Abstract:

An independently packaged bridge-type magnetic-field angle sensor comprising a pair of half-bridge MTJ sensing elements rotated relative to each other by 90 degrees, said elements being used for measuring two magnetic field components in orthogonal directions respectively. The sensor can also comprise a pair of MTJ full-bridges, each MTJ full-bridge comprising a pair of MTJ sensor chips connected through a lead and located in a lead frame having a semiconductor package. The sensor can be packaged into various standard semiconductor packages or be packaged into low-cost semiconductor packages.

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Inventors:

DEAK JAMES GEZA (CN)
SHEN WEIFENG (CN)
WANG JIANGUO (CN)
ZHANG XIAOJUN (CN)
LEI XIAOFENG (CN)
JIN INSIK (CN)
XUE SONGSHENG (CN)

Application Number:

PCT/CN2012/071879

Publication Date:

September 07, 2012

Filing Date:

March 02, 2012

Export Citation:

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Assignee:

JIANGSU MULTIDIMENSIONAL TECHNOLOGY CO LTD (CN)
DEAK JAMES GEZA (CN)
SHEN WEIFENG (CN)
WANG JIANGUO (CN)
ZHANG XIAOJUN (CN)
LEI XIAOFENG (CN)
JIN INSIK (CN)
XUE SONGSHENG (CN)

International Classes:

G01B7/30; G01R33/09; G01D5/16; H01L43/08

Foreign References:

CN102298124A	2011-12-28
CN1694277A	2005-11-09
CN101308199A	2008-11-19
CN101290343A	2008-10-22
CN101088019A	2007-12-12
US20110025319A1	2011-02-03
US6329818B1	2001-12-11
JP2006010579A	2006-01-12

Other References: