Title:
SERVER DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/049807
Kind Code:
A1
Abstract:
[Problem] To provide a server device which is capable of both mounting heating members in high density and achieving high cooling performance. [Solution] The server device comprises a circuit board (21) on which heating members (22b) and a heat-radiating member (23) are mounted on one surface and another surface, respectively, so as to face each other; and a sealed container (11) housing the circuit board in the interior thereof. The circuit board is provided in the interior with a plurality of thermal vias (25) thermally connecting the heating members and the heat-radiating member, and the heat-radiating member is immersed, in the interior of the sealed container, in an insulating inert refrigerant (31) in a liquid phase state.
Inventors:
SANO KENTAROH (JP)
NISHIHARA ATSUO (JP)
KATO TAKESHI (JP)
YORITA CHIKO (JP)
NISHIHARA ATSUO (JP)
KATO TAKESHI (JP)
YORITA CHIKO (JP)
Application Number:
PCT/JP2013/077186
Publication Date:
April 09, 2015
Filing Date:
October 04, 2013
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H05K7/20; H05K1/02; H05K3/46
Domestic Patent References:
| WO2010084717A1 | 2010-07-29 |
Foreign References:
| JP2008227150A | 2008-09-25 | |||
| JP2010080572A | 2010-04-08 | |||
| JP2003338577A | 2003-11-28 | |||
| JP2009015869A | 2009-01-22 | |||
| JPH0677281U | 1994-10-28 |
Attorney, Agent or Firm:
ISONO Michizo (JP)
Michizo Isono (JP)
Michizo Isono (JP)
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