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Title:
SHAPE CORRECTION DEVICE AND SHAPE CORRECTION METHOD FOR GRAPHIC PATTERNS
Document Type and Number:
WIPO Patent Application WO/2018/235669
Kind Code:
A1
Abstract:
In the present invention, an actual graphic pattern (20) is formed on an actual substrate (S) by lithography based on an original graphic pattern (10). An assessment point setting unit (110) sets assessment points on the original graphic pattern (10), and a feature amount extraction unit (120) extracts feature amounts (x1 to xn) indicating features of assessment point positions. An optimal correction bias estimation unit (130Z) estimates an optimal correction bias (z) indicating an assessment point position correction amount that is required in order to bring the actual graphic pattern (20) close to the original graphic pattern (10) on the basis of the feature amounts. The estimation is performed with the use of learning information (LZ) obtained from a learning stage that has been performed in advance. A pattern correction unit (140Z) performs correction for moving the positions of the assessment points of the original graphic pattern (10) on the basis of the optimal correction bias (z), and creates a corrected graphic pattern (35). This corrected graphic pattern (35) is used to perform lithography.

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Inventors:
SHIMOMURA TAKEYA (JP)
OOKAWA YOUHEI (JP)
Application Number:
PCT/JP2018/022295
Publication Date:
December 27, 2018
Filing Date:
June 12, 2018
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
G03F7/20; G06F17/50; G06N3/02; H01L21/027
Foreign References:
JP2003151885A2003-05-23
JP2010044101A2010-02-25
JP2009194062A2009-08-27
JP2008071928A2008-03-27
JP2007249167A2007-09-27
JP2006165267A2006-06-22
JP2005195787A2005-07-21
JP2004279950A2004-10-07
JPH1116801A1999-01-22
JPH0794376A1995-04-07
Attorney, Agent or Firm:
SHIMURA Hiroshi (JP)
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