SHAPE MEASUREMENT DEVICE - TOKYO SEIMITSU CO LTD

Title:

SHAPE MEASUREMENT DEVICE

Document Type and Number:

WIPO Patent Application WO/2016/158530

Kind Code:

A1

Abstract:

The first purpose of the present invention is to achieve reduced burden of measurement work, improved measurement efficiency, and the like by effectively using, for surface roughness measurement, data obtained by roundness measurement, and the second purpose thereof is to achieve improved measurement efficiency of roundness measurement and surface roughness measurement, and improved measurement accuracy and the like by effectively using data obtained by roundness measurement and surface roughness measurement for each other. To accomplish the first purpose, a measurement condition for surface roughness measurement is set on the basis of data relating to an object to be measured and obtained by roundness measurement. To accomplish the second purpose, a shape measurement device is provided with: a first measurement unit that performs roundness measurement of an object to be measured, and a second measurement unit that performs surface roughness measurement of the object to be measured at a position on the circumferentially opposite side to the first measurement unit, and performs the roundness measurement by the first measurement unit and the surface roughness measurement by the second measurement unit at the same time.

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Inventors:

SEKIMOTO MICHIHIRO (JP)
TAKANASHI RYO (JP)
KIMURA HIROAKI (JP)
MASUTA HIKARU (JP)

Application Number:

PCT/JP2016/058844

Publication Date:

October 06, 2016

Filing Date:

March 18, 2016

Export Citation:

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Assignee:

TOKYO SEIMITSU CO LTD (JP)

International Classes:

G01B5/28; G01B5/20

Foreign References:

JP2014137339A	2014-07-28
JP2009115527A	2009-05-28
JP2007225380A	2007-09-06
JP4884091B2	2012-02-22
JPH1163971A	1999-03-05
JP2001033233A	2001-02-09

Other References: