SHAPE-MEMORY ALLOY LOCK FOR CONNECTORS

Title:

SHAPE-MEMORY ALLOY LOCK FOR CONNECTORS

Document Type and Number:

WIPO Patent Application WO/2023/103665

Kind Code:

A1

Abstract:

A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

Inventors:

LEWIS THERON LEE (US)
BRAUN DAVID J (US)
BIELICK JAMES D (US)
DANGLER JOHN R (US)
YOUNGER TIMOTHY P (US)
JENNINGS TIMOTHY (US)
BENNETT JENNIFER I (US)
HUGO STEPHEN MICHAEL (US)

Application Number:

PCT/CN2022/129635

Publication Date:

June 15, 2023

Filing Date:

November 03, 2022

Export Citation:

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Assignee:

IBM (US)
IBM CHINA CO LTD (CN)

International Classes:

H01R13/502; H01R12/75; H01R13/639; H01R43/20

Foreign References:

US20210075143A1	2021-03-11
US4793821A	1988-12-27
CN107408774A	2017-11-28
US20020137390A1	2002-09-26
US3801954A	1974-04-02
US4775334A	1988-10-04

Attorney, Agent or Firm:

KING & WOOD MALLESONS (CN)

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