SHAPED ARTICLE, ELECTRONIC EQUIPMENT, AND SHAPING METHOD

Title:

SHAPED ARTICLE, ELECTRONIC EQUIPMENT, AND SHAPING METHOD

Document Type and Number:

WIPO Patent Application WO/2017/098640

Kind Code:

A1

Abstract:

A laminated structure 21 formed by forming thin layers by melting and hardening (sintering) powder of a thermoplastic resin with laser light, and laminating the thin layers comprises: a body part 21a having an ejection port 22 and a suction port 25b on a surface thereof; and a hollow part 21b communicating with the ejection port 22 and the suction port 25b and formed inside the body part 21a. In addition, the laminated structure 21 has a structure in which a part (nozzle 23) of which a size of a cross section in a direction crossing an extending direction of the hollow part 21b changes in the extending direction is disposed in the hollow part 21b.

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Inventors:

FURUICHI HIROAKI (JP)

Application Number:

PCT/JP2015/084692

Publication Date:

June 15, 2017

Filing Date:

December 10, 2015

Export Citation:

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Assignee:

HITACHI LTD (JP)

International Classes:

B29C67/00; B33Y10/00; B33Y80/00

Foreign References:

JP2000190086A	2000-07-11
JP2012070916A	2012-04-12
JP2005166855A	2005-06-23
JP2015123743A	2015-07-06
JP2003225948A	2003-08-12
JPH115254A	1999-01-12

Attorney, Agent or Firm:

TSUTSUI & ASSOCIATES (JP)

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